About the TCS Solder Alloy Solutions Database (TCSLD)

TCS Solder Alloy Solutions Database (TCSLD) is a thermodynamic and properties database for applications to solder and brazing alloys. The database enables pre-screening of potential solder candidate compositions and predictions of various thermodynamic properties and phase equilibria. The database also provides information on possible interfacial reactions.

The results from these predictions can be applied to eliminate candidate solder alloys for which the calculations reveal unsuitable freezing temperature ranges and undesired phases from further testing. Thus, the database can accelerate design of new solder alloys as well as improve understanding of existing solder alloys in terms of their processing and in-service behavior.

The database contains all the important solder alloy systems, such as Sn-/Au-/Bi-/Zn-based solders and Cu, Ni, Pd, and so on, relevant substrate or metallization materials. It is validated where possible against commercial solder alloys and available experimental information.

In addition to thermodynamic data, it has properties data available for:

  • Molar volume with thermal expansion coefficients
  • Electrical resistivity
  • Thermal conductivity
  • Viscosity of metallic liquids
  • Surface tension of metallic liquids

TCSLD5 Thermophysical Properties

The database can be used with our entire suite of products: Thermo-Calc, the Add-on Diffusion (DICTRA), Precipitation (TC-PRISMA), and/or Additive Manufacturing Modules, and all available SDKs.

The thermodynamic database is compatible with the corresponding mobility database TCS Solder Alloy Solutions Mobility Database (MOBSLD) that provides kinetic data for those working with the add-on kinetic modules – the Diffusion Module (DICTRA) and the Precipitation Module (TC-PRISMA) – as well as a few specific calculation types, such as Scheil with back diffusion. The current version of the mobility database is MOBSLD2.

There are examples available to both demonstrate the validation of the database and to showcase the types of calculations that can be used for different materials or application area.

About the Database Examples

A range of properties can easily be calculated with TCSLD5, including:

  • Liquidus and solidus temperatures as a function of compositions.
  • Isothermal or vertical section phase diagrams.
  • Phase formation, phase fractions and phase compositions.
  • Thermodynamic driving force for the formation of intermetallic compounds (IMCs).
  • Predict non-equilibrium solidification behavior of solder alloys. This can be at specific cooling rates when using the 'Back diffusion in primary phase' option with the Scheil Calculator.

By using the Diffusion Module (DICTRA) in conjunction with a suitable mobility database, diffusion-controlled interface reactions during the soldering process can be simulated so that the reliability of solder joints can be predicted to a certain extent, for example to:

  • Predict the growth of intermetallic compounds
  • Simulate the dissolution of substrate

It is possible to combine several databases to make calculations using Thermo‑Calc. For more information related to a specific type of problem, contact one of our support specialists at info@thermocalc.com. The experts are available to make recommendations on the most suitable database to use for your needs.

TCSLD: TCS Solder Alloy Solutions Database Revision History. The current version of the database is TCSLD5. See the link for any subversion release details.