MOBSLD2: TCS Solder Alloy Solutions Mobility Database

TCS Solder Alloy Solutions Mobility Database (MOBSLD) is a kinetic database containing mobility data for solder alloys. It is suitable for simulation of diffusion controlled phenomena using the add-on Diffusion Module (DICTRA) and/or Precipitation Module (TC-PRISMA). It can also be used together with all Thermo‑Calc Software Development Kits (SDKs). The database is compatible and recommended for use in combination with the TCS Solder Alloy Solutions Database (TCSLD).

Used together with the Diffusion Module (DICTRA) and a thermodynamic database for solder alloys (e.g. TCSLD5), the database can be used to study diffusion-controlled phenomena in solder/substrate systems, such as solidification, growth of interfacial compounds, dissolution of substrates, interdiffusion, and much more.

Similarly, when combined with the Precipitation Module (TC-PRISMA), it is suitable to simulate concurrent nucleation, growth, and coarsening of precipitates in solder alloys.

MOBSLD: TCS Solder Alloy Solutions Mobility Database Revision History. The current version of the database is MOBSLD2. See the link for any subversion release details.

The CALPHAD Method

The Thermo‑Calc databases are developed with the CALPHAD approach based on various types of experimental data and theoretical values (e.g. those from first-principles calculations). It is based on the critical evaluation of binary, ternary, and for some databases, important higher order systems. This enables predictions to be made for multicomponent systems and alloys of industrial importance. Among these, the thermodynamic database is of fundamental importance.

The CALPHAD Method and the Thermo‑Calc Databases. Also visit the video tutorials on our website or our YouTube playlist.

Additional Resources

Go to the Solder Alloys Databases page on our website where you can access this Technical Information plus learn more about the compatible thermodynamic database and its Validation and Calculation Examples Collection. Also explore further applications of Thermo‑Calc to solders including links to resources such as examples, publications, and more.