MOBSLD: TCS Solder Alloy Solutions Mobility Database Revision History

Current Database Version

Database name (acronym):

TCS Solder Alloy Solutions Mobility Database (MOBSLD)

Database owner:

Thermo‑Calc Software AB

Database version:

2.1

First release:

MOBSLD1 was released with 2017a

Changes in the Most Recent Database Release

Software release version 2025b (June 2025)

  • The mobility parameters for Al, Au, Bi, Co, Ge, Mn, Ni, In, Pb, Pd, Pt, Sb, Si in the CU6SN5_HT_NIAS compound are added.
  • The mobility parameters for elements in the TETRAGONAL_A6 solution phase are added.

Previous Releases

Software release version: 2024b (June 2024)

  • Three new elements: Hf, Ti, and Zr are added to make a 24 element framework.
  • Updated compounds: Ni3SN4, CU2IN_LT, CU7IN3, ALCU_ZETA, CU5ZN8_GAMMA, and CU3SN.
  • Added self- and impurity diffusivity data for Hf-X, Ti-X, and Zr-X binary systems.
  • The description of diffusion in the LIQUID phase is greatly improved.
  • The HCP_A3 phase is restored as the lattice stability of Zn, and the interaction parameters are adjusted accordingly.

  • FCC_A1

    • Binary: Ag-Ge, Ag-Mg, Ag-Mn, Ag-Pd, Al-Pt, Al-Ti, Al-Zr, Au-Pt, Co-Mn, Co-Ti, Cu-Ge, Ni-Pd, Ni-Ti, and Pd-Pt.
    • Ternary: Ag-Cu-Ni, Ag-Sn-Zn, Cu-Sn-Zn, Cu-Ni-Sn, Cu-Al-Ni and Cu-Al-Sn.
    • Quaternary: Cu-Ni-Al-Sn and Cu-Ni-Al-Zn.

  • HCP_A3

    • Binary: Ag-Mg, Ag-Ti, Cu-Ti, Mg-Ga, and Mg-Zn.
    • Ternary: Mg-Ag-Zn