Common Phases for the Solder Alloys
The following lists common phase names and the corresponding Thermo‑Calc database phase names for some key solder systems.
| Name in the Database | Common Name and Description |
|---|---|
|
FCC_A1 |
Substrate material such as copper, nickel, silver, palladium |
|
CU6SN5_HT_NIAS |
Cu6Sn5, or η phase, a common intermetallic compoud which forms at the solder/substrate interface. |
|
CU3SN |
Cu3Sn, or ε phase, a common intermetallic compoud which forms at the solder/substrate interface. |
|
NI3SN4 |
Ni3Sn4, a common intermetallic compoud which forms at the interface between solder alloy and Ni substrate. |