Surface Tension of Cu–Sn–Bi–In–Pb Alloy
The surface tension thermophysical property data is included with the TCS Solder Alloy Solutions Database (TCSLD) starting with version 4 (TCSLD4).
Surface tension plays an important role in wetting of solders. Good wetting of the part by the solder is critical to ensuring joint quality. The chemistry and temperature effect on surface tension can be calculated with Thermo‑Calc.
The temperature dependencies of the surface tension of liquid high- entropy equiatomic Cu–Sn–Bi–In–Pb alloy on heating and cooling is shown.
Figure 1: Calculated surface tension of equiatomic Cu-Sn-Bi-In alloy along with experimental data from [2017V’yu].
Figure 2: Calculated surface tension of equiatomic Cu-Sn-Bi-In-Pb alloy along with experimental data from [2017V’yu].
Reference
[2017 V’yu] V. V. V’yukhin, O. A. Chikova, V. S. Tsepelev, Surface tension of liquid high-entropy equiatomic alloys of a Cu–Sn–Bi–In–Pb system. Russ. J. Phys. Chem. A. 91, 613–616 (2017).