Ternary Isothermal Section
Cu-Ni-Sn is a key system in understanding the intereactions between the SnAgCu (SAC) solder and Ni substrate.
Cu-Ni-Sn
The Cu-Ni-Sn ternary system has been re-assessed in the TCS Solder Alloy Solutions Database (TCSLD) by taking into account recent experimental observations.
Figure 1: Calculated Cu-Ni-Sn isothermal section at 400 °C compared to experimental data from [2008Sch].
Reference
[2008Sch] C. Schmetterer, H. Flandorfer, C. Luef, A. Kodentsov, H. Ipser, Cu-Ni-Sn: A Key System for Lead-Free Soldering. J. Electron. Mater. 38, 10–24 (2008).