Viscosity: Ag-Cu, Ag-Sn, and Sn-Ag-Cu
The viscosity thermophysical property data is included with the TCS Solder Alloy Solutions Database (TCSLD) starting with version 4 (TCSLD4).
Ag-Cu
Figure 1: Calculated dynamic viscosity of Ag-Cu at 1371 K with experimental data from [1994See; 2008Bri; 2015Zha; 2018Bri; 2019Yan].
Ag-Sn
Sn-Ag-Cu
References
[1994See] S. Seetharaman, D. Sichen, Estimation of the viscosities of binary metallic melts using Gibbs energies of mixing. Metall. Mater. Trans. B. 25, 589–595 (1994).
[2006Ple] Y. Plevachuk, V. Sklyarchuk, W. Hoyer, I. Kaban, Electrical conductivity, thermoelectric power and viscosity of liquid Sn-based alloys. J. Mater. Sci. 41, 4632–4635 (2006).
[2008Bri] J. Brillo, R. Brooks, I. Egry, P. Quested, Density and viscosity of liquid ternary Al-Cu-Ag alloys. High Temp. - High Press. 37, 371–381 (2008).
[2011Roz] E. V. Rozhitsina, S. Gruner, I. Kaban, W. Hoyer, V. E. Sidorov, P. S. Popel’, Dynamic viscosities of pure tin and Sn-Ag, Sn-Cu, and Sn-Ag-Cu eutectic melts. Russ. Metall. 2011, 118–121 (2011).
[2015Zha] Y. Zhao, X.-X. Hou, Viscosities and their correlations with structures of Cu–Ag melts. Chinese Phys. B. 24, 096601 (2015).
[2018Bri] J. Brillo, E. Arato, D. Giuranno, H. Kobatake, C. Maran, R. Novakovic, E. Ricci, D. Rosello, Viscosity of liquid Ag-Cu alloys and the competition between kinetics and thermodynamics. High Temp. - High Press. 47, 417–441 (2018).
[2019Yan] J. Yang, Y. Wang, J. Huang, W. Wang, Z. Ye, S. Chen, Y. Zhao, Investigation on viscosity, surface tension and non-reactive wettability of melting Ag-Cu-Xwt%Ti active filler metals. J. Alloys Compd. 772, 438–446 (2019).