Binary Phase Diagrams
Included binary systems in the TCS Solder Alloy Solutions Database (TCSLD) are critically assessed based on available experimental and theoretical data for phase diagram and thermodynamic properties.
Some important key binary systems for lead-free solders are shown here, for example, Ag-Sn and Cu-Sn are sub-systems of the SnAgCu solder alloys, and Cu is commonly used in substrate materials. Ag3Sn is often observed in solidified solder bulk alloys, Cu6Sn5_HT and Cu3Sn are commonly interfacial reaction products.
The CALPHAD Method and the Thermo‑Calc Databases. Also visit the video tutorials on our website or our YouTube playlist.
When working in Thermo‑Calc with binary diagrams you use either the Binary Calculator (in Graphical Mode) or the Binary module (in Console Mode). The fundamental calculation engine is the same but you access the settings in different ways.
Ag-Sn
Figure 1: Calculated Ag-Sn phase diagram [1996Oh].
Cu-Sn
Figure 2: Calculated Cu-Sn phase diagram [2001Liu].
References
[1996Oh] C.-S. Oh, J.-H. Shim, B.-J. Lee, A thermodynamic study on the Ag-Sb-Sn system. J. Alloys Compd. 238, 155–166 (1996).
[2001Liu] X. J. Liu, H. S. Liu, I. Ohnuma, R. Kainuma, K. Ishida, S. Itabashi, K. Kameda, K. Yamaguchi, Experimental determination and thermodynamic calculation of the phase equilibria in the Cu-In-Sn system. J. Electron. Mater. 30, 1093–1103 (2001). The Cu6Sn5_HT phase was modified in TCSLD2, Thermo‑Calc Software AB, Sweden (2014).