TCCU6 Thermophysical Properties
This section summarizes the available properties in the TCS Cu-based Alloys Database (TCCU).
The properties data was gradually added to the database versions as follows. Molar volume with thermal expansion coefficients available starting with TCCU1, the viscosity of and surface tension of liquids starting with TCCU4, and electrical resistivity and thermal conductivity starting with TCCU6.
Model Descriptions
For model descriptions, see:
- Molar Volume Model
- Electrical Resistivity Model
- Thermal Conductivity Model
- Electrical Conductivity for Ionic Liquid Model
- Surface Tension of Metallic Liquid Alloys Model
- Viscosity of the Metallic Liquids Model
Parameters and Variables
Below is a summary of the available thermophysical parameters and variables for the databases when working in Thermo‑Calc. There are differences when you are working in Console Mode versus Graphical Mode as well as if you use an SDK such as TC‑Python or TC-Toolbox for MATLAB®.
Property (and Graphical Mode Variable Name) | Model Parameters | Variables to Show or Plot in Console Mode or the SDKs (TC‑Python, or TC-Toolbox for MATLAB®)*** |
---|---|---|
Molar volume |
V0, VA |
VM for a system |
Electrical conductivity |
ELQ** |
ELCD for a system |
Electrical resistivity |
ELRS, ESPD |
ELRS for a system |
Thermal conductivity |
THCD |
THCD for a system |
Thermal resistivity |
|
THRS for a system |
Thermal diffusivity |
|
THDF for a system |
Surface tension |
SIGM, XI* |
SURF(LIQUID)
|
Dynamic viscosity |
VISC |
|
Kinematic viscosity |
|
KVIS(LIQUID)
|
* XI is not used in the TCOX database (all versions). As of 2023b it is also not used starting with the following versions of these databases: TCFE13, TCNI12.1, TCTI5.1, TCNOBL3, TCPMAG2, and TCCU6. As of 2024a, TCMG7, TCAL9, and TCHEA7. As of 2024b, TCSLD5. ** *** The examples listed for the SDKs are using Console Mode syntax. The quantities can also be accessed in both |
Examples
For examples using this database, see:
- Surface Tension of Ag-Cu-Sn and Surface Tension of Cu–Sn–Bi–In–Pb Alloy
- Viscosity: Ag-Cu, Ag-Sn, and Sn-Ag-Cu and Viscosity: SAC Alloy and Cu-Ti-Zr
- Thermal Conductivity of Copper Alloys
For surface tension, viscosity, and molar volume general use examples, see T_11: Surface Tension in Cu-Zr, T_12: Viscosity in Cr-Ni, and T_15: Molar Volume and Thermal Expansion Coefficients for L12-type Al3Sc and Al3Zr Compounds (Graphical Mode) and Thermophysical Properties Examples (Console Mode)
For electrical resistivity and thermal conductivity general use examples, see T_16: Electrical Resistivity and Thermal Conductivity for Pure Copper (Graphical Mode) and Thermophysical Properties Examples (Console Mode)